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X-WR-CALDESC:Évènements pour Centre français de fiabilité
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SUMMARY:CARAC’2023
DESCRIPTION:[COLLOQUE] CARAC’2023 :\nLA CARACTÉRISATION AU SERVICE DE LA CONFIANCE POUR L’INDUSTRIE\n\nLe temps d’une journée parisienne\, découvrez toute l’expertise des instituts de recherche technologique et des Instituts pour la transition énergétique en caractérisation au service de la confiance pour l’industrie : fiabilité des systèmes\, analyse de défaillance et matériaux. \nUn colloque organisé sous l’égide de l’association FIT des instituts de recherche technologique et des instituts pour la transition énergétique\, avec le soutien du projet Horizon 2020 Streamline. \n 
URL:https://www.cff-fiabilite.fr/evenements/carac2023/
LOCATION:Paris
CATEGORIES:relayé par le CFF
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DTSTART;VALUE=DATE:20231130
DTEND;VALUE=DATE:20231201
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SUMMARY:IMAPS - POWER 2023
DESCRIPTION:From Nano to Macro Power Electronics and Packaging European Workshop\n14th Power Electronics and Packaging Technical Workshop\n30 November 2023 | Tours\, France\nvoir https://france.imapseurope.org/ \nTOPICS :\n– Power management for transportation and industrial systems\n– Energy harvesting systems\, from nano to macro (smart grid\, wind energy\, photovoltaic\, etc…)\n– Energy conversion systems– from power to emission (lighting\, ultrasonic\, infrared\, etc…) \nThese topics could be developed around several themes\, such as:\n– New materials and substrates dedicated to power electronics\n– Thermal or thermo mechanical or regulatory constraints (RoHS regulation\, REACH\, etc…)\n– Dedicated technologies for integration and optimisation of power systems\, including passive\ncomponents (weight and size reduction\, yield improvement\, efficiency\, etc…)\n– Innovative technologies\, materials and processes dedicated to interconnection and packaging (die\nattach\, bonding wire & ribbon wires\, 3D power components\, etc…)\n– Reliability and failure modes (impacts linked to technologies\, thermal constraints\, radiation\, etc…)\,\npredictive methods\, design of experiments\, reliability\n– High current and high voltage or extremely high voltage: impact on packaging technologies \n\n\nWho We Are…\n\n\n\n\nIMAPS – International Microelectronics Assembly and Packaging Society – is a global community of microelectronic related engineers\, scientists\, manufacturers\, end-users and supply chain companies. \nThe Society aims to support the development and growth of the Microelectronics and related industries\, and to aid the transfer of knowledge and information. This is achieved through networking\, seminars\, workshops\, short courses\, publications\, webinars and websites. \nMembers benefit from access to business networking and events at a reduced rate; technical information & receive society newsletters and other publications. IMAPS is the largest Microelectronic Packaging Society in the World ! \nIMAPS-France (French chapter) is a non-profit organization with 110 members in 2021 from 110 companies or institutes in France and neighbouring countries (Belgium\, Switzerland\, Morocco\, Spain\, Portugal). IMAPS-France is one out of the 30 IMAPS chapters throughout the World. \nTo that end\, we organize events each year. In 2022-2023\, in French OR English language\, these are namely: \n\nMINaPAD 2023   7th & 8th June 2023\nPOWER 2023      30th November 2023\n\nWe will be glad to see you join us for one of these events.
URL:https://www.cff-fiabilite.fr/evenements/imaps-power-2023/
CATEGORIES:relayé par le CFF
ORGANIZER;CN="IMAPS":MAILTO:imaps.france@orange.fr
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